(주)에이티에스

(주)에이티에스

제품소개

Home 제품소개 Thermal Gap Filler

실리콘 Thermal Gap Filler

비경화형 실리콘 방열 소재
  • 특징 및 장점

    열 전도도 : 3W/mk , 4W/mk

    저비중 : 1.85 ~ 2.4

    Low Oil Bleeding

  • 적 용

    EV Battery Pack, OBC&LDC

    Fuel Cell Electronic Vehicle Reactor

Properties Unit Specifications Test Method
2G030-L 2G030-M 2G040
Thermal Conductivity W/m·K >3.3 >3.3 >4.0 ASTM D 5470
>2.3 >2.3 >3.0 ISO 22007-2 (HOT DISK)
Specific Gravity g/cm < 1.85 2.0 < 2.4 ASTM D 792
Dielectric breakdown KV/mm > 5 > 10 > 10 ADTM D 149
Hardness Shore 00 45±10 45±10 45±10 ASTM D 2240
Curing Time Hour 24hr@25℃ 24hr@25℃ 24hr@25℃ Max.1: Time to become Hardness 60 at 120℃
Max.24: Time to become Hardness 40
Intial curing speed minute 2hr 2hr 2hr Time to Tack Free at 25℃
Flame Retardant - V-0 V-0 V-0 UL 94V
Viscosity Base cps 65,000±10,000 160,000±15,000 210,000±30,000 BROOK FIELD
@spindle no.52
@shear rate 2.4 @25±0.5℃
Catalyst Cps 70,000±10,000 160,000±15,000 210,000±30,000
Mixes Cps 70,000±10,000 160,000±15,000 210,000±30,000
Color Base - Black Adjustable Adjustable Visual
Catalyst - White Adjustable Adjustable
Mixing Ratio - 1:1 1:1 1:1